abstract |
(57) [Problem] To provide a small-sized, high-density ceramic multilayer wiring board on which fine and high-precision soldering lands are formed. A plurality of surface wiring patterns (4) are provided. In addition, the ceramic multilayer wiring board 1 has a linear insulating pattern 8 so as to intersect each surface wiring pattern, and the soldering land 7 is defined by the insulating pattern 8. |