| abstract |
(57) [Problem] To provide a photosensitive resin composition having high resolution, particularly excellent in adhesion of fine wires, and free from edge fusion. The photosensitive resin composition contains a binder component (A), a monomer component (B), and a photopolymerization initiator (C). The binder component (A) contains at least an acrylic resin having a weight average molecular weight of 5,000 to 45,000, and the monomer component (B) contains at least a compound represented by the following general formula (1). contains. Embedded image |