| abstract |
PROBLEM TO BE SOLVED: To provide a new cleaning composition having excellent cleaning power against surface contamination of various kinds of precision-processed glass and ceramic equipment used for manufacturing a semiconductor wafer or a wafer, and a wafer cleaning method. A cleaning method, a semiconductor wafer, and a method for manufacturing a semiconductor wafer are provided. A semiconductor wafer is cleaned using a cleaning composition containing a specific fluorinated anionic surfactant and a quaternary ammonium hydroxide and / or alkanolamine. |