http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001316567-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2000-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
| publicationDate | 2001-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001316567-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent properties in flame retardancy, high-temperature storage properties and moisture resistance reliability. . SOLUTION: After coating the surface of (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) red phosphorus with aluminum hydroxide, further coat the surface. An epoxy resin composition for semiconductor encapsulation, comprising a red phosphorus-based flame retardant having an average particle size of 0.1 to 70 μm and a maximum particle size of 200 μm or less as an essential component, coated with an epoxy resin-based coating agent. object. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011042717-A |
| priorityDate | 2000-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.