| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-68 |
| filingDate |
2000-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0665033e79cda0a9c8bb5ac2e2fba21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7fb07db59d62ef8767df1a524745d3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc00995fea568242a1d4342b5925662d |
| publicationDate |
2001-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001313239-A |
| titleOfInvention |
Hot plate unit for semiconductor manufacturing equipment |
| abstract |
(57) [Summary] To provide a hot plate for drying a silicon wafer excellent in temperature uniformity. An opening (4) of a casing (2) having a bottomed shape is provided. A hot plate 3 made of a ceramic sintered body having a resistor 10 is provided. Hot plate 3 into casing 2 Is fixed to the opening 4 via a heat insulating seal ring 14. |
| priorityDate |
1999-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |