| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0361 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2000-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0172bfd63af922d5f166a221ae3bf172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c9e19cb5a07bf3af347ca41ca407431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7a4193afed4b33af6fce46ca6d72afe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dd45eda453400b3a5c5fcd73943a096 |
| publicationDate |
2001-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001308544-A |
| titleOfInvention |
Manufacturing method of printed wiring board |
| abstract |
(57) [Problem] To provide a method for manufacturing a printed wiring board by simultaneously drilling a copper foil layer and a base resin layer of a copper-clad laminate using a carbon dioxide gas laser. SOLUTION: When a through-hole or a hole such as IVH or BVH is formed in a copper-clad laminate using a carbon dioxide gas laser, an auxiliary metal layer is formed as an auxiliary metal layer on a copper foil surface located on an outer layer of the copper-clad laminate. 08-2 μm thick nickel layer, 0.05-3 A copper layer having a thickness of μm or a zinc layer having a thickness of 0.03 to 2 μm is formed as an auxiliary metal layer, and then a laser drilling process is performed to form a copper foil layer and a base resin layer of the copper clad laminate. Can be simultaneously drilled. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014053342-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004314568-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6716572-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004289109-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7037597-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004335784-A |
| priorityDate |
2000-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |