| abstract |
(57) Abstract: Provided is a semiconductor device having a three-dimensional mounting module configuration using a flexible circuit board excellent in three-dimensional assembly easiness and repair (or rework) workability. A mounting area of a flexible circuit board is provided. 1, 112, and 113 mainly include electronic components 121, 122 and 123 are mounted correspondingly, and other electronic components 124 and 125 are also mounted. The flexible circuit board 13 includes the mounting regions 111 to 113 in the base region 1. The upper part 10 is folded in a predetermined order (f1 to f3). The integrated spacer 13 has a thick region 131 and a thin region 132, and is overlapped and fixed on the flexible circuit board 11 as shown by the dashed arrow, and each of the electronic components 121 to 12 is fixed. Support 5 stacks. In order to facilitate positioning, a fixing boss 134 and an opening 14 that fits therein are provided. |