http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001308153-A

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filingDate 2001-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001308153-A
titleOfInvention Wafer level burn-in using light as stimulus signal
abstract [PROBLEMS] To provide a method and an apparatus for burning in a circuit in a wafer state. A method of test operating an element of an integrated circuit (16) includes providing an integrated circuit (16) having a photosensitive device (20) and an element (24), wherein the photosensitive device (20) is electrically connected to the element (24). Connecting the integrated circuit 16 to an electrical source, stimulating the photosensitive device 20 with light 192, and causing a current 196 to flow through the photosensitive device 20 from the electrical source to the element 24; And performing a test operation of
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