http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001295057-A

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filingDate 2000-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e1dfaa1fa573063bd0f19a0c1d18a1f
publicationDate 2001-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001295057-A
titleOfInvention Copper surface treatment solution, copper surface treatment method using the same, and method for manufacturing printed wiring board
abstract (57) [Summary] [Problem] To be able to use formaldehyde as a reducing agent in a stable state for a long time, to improve the working efficiency, and to suppress the amount of highly dangerous formaldehyde discharged outside the factory. Provided are a copper surface treatment solution, a copper surface treatment method using the same, and a method for producing a printed wiring board. A copper surface treatment solution containing formaldehyde and tetraboric acid or a salt thereof. And a. Contacting the copper surface with an aqueous solution containing an oxidizing agent to form copper oxide on the copper surface; b. Reducing the oxidized copper surface by contacting the oxidized copper surface with an aqueous solution containing alkali borohydride; c. A copper surface treatment method for reducing copper oxide formed on the copper surface by the step of further reducing the copper surface by contacting with a copper surface treatment solution containing formaldehyde and tetraboric acid or a salt thereof, And a method of manufacturing a printed wiring board.
priorityDate 2000-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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