| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 |
| filingDate |
2000-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64dc32247c98840722c90544c2952930
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b609ab79563b129b56dddb599661852c |
| publicationDate |
2001-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001291687-A |
| titleOfInvention |
Apparatus and method for controlling and delivering slurry to the area of a polishing apparatus |
| abstract |
(57) [Summary] (with modifications) [PROBLEMS] To provide a polishing pad and / or platen for use in a chemical mechanical polishing system. SOLUTION: A polishing pad and / or a platen has a slurry sending / holding groove formed on a surface thereof. In one embodiment, groove 60A is formed in the upper polishing surface of pad 45A for use in a rotary or linear polishing system. In another embodiment, the upper mounting surface of the platen is patterned with grooves. The grooves are adapted to direct the slurry flow inward from the periphery of the pad / platen. In operation, the grooves provide a uniform delivery of slurry to the area on the polishing pad / platen. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4568015-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004358653-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016507388-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008168430-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005177934-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008507148-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100341666-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007214379-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005191565-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101107636-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006192568-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4689240-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005183708-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005224937-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4563025-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005150744-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9592584-B2 |
| priorityDate |
1999-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |