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filingDate 2000-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3a151d069170568a1a2f00eb24b7590
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publicationDate 2001-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001291431-A
titleOfInvention Composition for anisotropic conductive sheet, anisotropic conductive sheet, method for producing the same, and contact structure using anisotropic conductive sheet
abstract (57) [Abstract] (with correction) [Problem] To increase the density of a conductive part and to have a low resistance of the conductive part, and furthermore, to provide heat resistance, durability, mechanical strength and adhesion to a semiconductor element. The composition for an anisotropic conductive sheet excellent in temperature and a method for producing the sheet and a contact structure using the sheet are provided. The composition for an anisotropic conductive sheet comprises a binder and a surface. And fibers imparted with magnetism and conductivity. In the anisotropic conductive sheet, fibers having a surface provided with magnetism and conductivity are oriented in a thickness direction of the sheet in a binder. The method for producing an anisotropically conductive sheet comprises forming the composition for an anisotropically conductive sheet into a sheet, and orienting the fibers having a surface provided with magnetism and conductivity in the thickness direction of the sheet, Cured or semi-cured. In the contact structure, the electrode portion of the semiconductor package and the wiring portion of the circuit board are electrically connected via the anisotropic conductive sheet.
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