http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001288420-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_356673625e931a8000bf747b93dc96a1
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
filingDate 2000-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec072cdce4cdd43d83b49a041356f695
publicationDate 2001-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001288420-A
titleOfInvention Heat release peelable adhesive film
abstract (57) [Summary] In a production processing process of an electronic component or the like, a sufficient adhesion force is maintained during the process to prevent peeling from an adherend during the process, and a heat treatment is performed after the processing. The present invention provides a heat-peelable adhesive film capable of lowering the adhesive force and easily peeling off from an adherend. A heat-peelable adhesive film obtained by forming a film at a temperature below the melting point of the metal soap or below the critical melting temperature with an adhesive film containing 0.01 to 5.0 parts by weight of metal soap. .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014124861-A
priorityDate 2000-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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