http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001288246-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
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filingDate 2000-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dfef1a9748bd8a358b3dfb035ad1f19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46abb55f5836baf67971972417304e72
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publicationDate 2001-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001288246-A
titleOfInvention Flame retardant novolak type epoxy resin, flame retardant thermosetting resin composition, printed wiring board and multilayer printed wiring board
abstract (57) Abstract: Provided is a printed wiring board having a non-halogen material, such as a flame-retardant resin, a flame-retardant resin composition, and a cured film thereof for use as an interlayer insulating layer of a multilayer printed wiring board. A flame-retardant novolak epoxy resin having a triazine structure in a molecule. A flame-retardant thermosetting resin composition containing the resin, another epoxy resin, an epoxy resin curable compound (curing agent), or a composition further containing an inorganic hydrate. Printed wiring boards and multilayer printed wiring boards having these cured films.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009245170-A
priorityDate 2000-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 45.