http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001279223-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0f8dc752059a228fada0efdcc2901b9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2000-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91675d16057b7f12f4cfb0323a5deef6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42f10d75ed6224717bfba1a6094077ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38f0a5aec527194a8b8e1e2a789532de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8d7d004a3f4e5a3a9f350c0f2cd0563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b43d458f64293c98c62d85e0891bbe7 |
| publicationDate | 2001-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001279223-A |
| titleOfInvention | Adhesive and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To firmly join a semiconductor pellet and a semiconductor pellet mounting member without deteriorating wire bondability to a semiconductor pellet, a lead frame or a circuit board, and adhesion to a sealing resin. The present invention provides an adhesive that can be used, and a semiconductor device having excellent reliability, in which a semiconductor pellet and a semiconductor pellet mounting member are joined by a cured product of the adhesive. SOLUTION: It is characterized by comprising an addition reaction-curable silicone rubber composition containing as a main component an organopolysiloxane having two or more silicon-bonded alkenyl groups and silicon-bonded hydrogen atoms on average in the same molecule. An adhesive for joining the semiconductor pellet to be attached to the semiconductor pellet mounting member, and a semiconductor device comprising the semiconductor pellet and the semiconductor pellet attaching member joined by the adhesive. |
| priorityDate | 2000-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.