http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001279193-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_250d7d24d096f307230e703f0ddc2275
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
filingDate 2000-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef5d89f73a0be74690b001f6a9a7028
publicationDate 2001-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001279193-A
titleOfInvention Semiconductor wafer fixing sheet
abstract [PROBLEMS] To provide a conventional semiconductor wafer fixing sheet, The cooling water supplied at the time of dicing the semiconductor wafer caused the adhesive of the semiconductor wafer fixing sheet to absorb water, and depending on the conditions, chips were mixed on the back surface of the chip or the adhesive was attached to the blade. The cutting chips cause chipping (a phenomenon in which a semiconductor wafer chip created at the time of cutting is partially chipped). A sheet for fixing a semiconductor wafer includes an ultraviolet ray transmitting sheet as a base material and an adhesive laminated on the ultraviolet ray transmitting sheet. Adhesive is base polymer 1 00 parts by weight, 5 to 300 parts by weight of an ultraviolet-crosslinkable oligomer, 0.1 to 15 parts by weight of photopolymerization initiator and 0.05 to curing agent It has 30 parts by weight, and the UV-crosslinkable oligomer is mainly composed of epoxy (meth) acrylate and / or epoxyalkyl (meth) acrylate represented by the following general formula. Embedded image
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101483076-B1
priorityDate 2000-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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