| abstract |
(57) [Abstract] [Problem] Reliability such as solder crack resistance and peeling resistance, Another object of the present invention is to provide a resin composition for semiconductor encapsulation which has excellent moldability such as fluidity during molding, curability, and releasability from a mold. An epoxy resin composition comprising an epoxy resin (A), a phenolic curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) has two epoxy groups. An epoxy resin (a) having two aromatic rings between two epoxy groups and having a structure having an oxygen or sulfur atom between the two aromatic rings. And the phenolic curing agent (B) contains, as an essential component, a phenolic compound (b) having two or more aromatic groups to which hydroxyl groups are directly connected, and an alicyclic group interposed between the aromatic groups. An epoxy resin composition for encapsulating a semiconductor, comprising: |