http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001279059-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2000-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fafbe833382bbc30babb4740273ad3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be430bad0577b49f0fdf311a83fad1f3 |
| publicationDate | 2001-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001279059-A |
| titleOfInvention | Epoxy resin composition |
| abstract | An object of the present invention is to provide an epoxy resin composition excellent in reliability and moldability, and a semiconductor device in which a semiconductor element is sealed by the epoxy resin composition. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and a filler (C), having the following characteristics (1) in a melt viscosity curve measured by a flow tester. A characteristic epoxy resin composition. (1) When the point showing the lowest melt viscosity is point a, the point 5 seconds after point a is point b, and the line connecting point a and point b is line ab, the slope of line ab is 3.5 or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003327667-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020137989-A1 |
| priorityDate | 2000-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.