| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38 |
| filingDate |
2000-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fb7d918ea8d0fa3c21d170c26841574
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6786839703a9acc427daa1f96ce7eb10 |
| publicationDate |
2001-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001279058-A |
| titleOfInvention |
Liquid resin composition and semiconductor device using the same |
| abstract |
(57) [Problem] To provide a liquid resin composition for semiconductor encapsulation excellent in low stress property and low warpage property. SOLUTION: (A) a liquid epoxy resin at room temperature having two or more glycidyl groups and one or more diglycidylaniline groups in one molecule, (B) a liquid epoxy resin at room temperature, C) a silicone-modified liquid epoxy resin having a disiloxane structure, (D) a liquid polyphenol, It is a liquid resin composition comprising (E) a curing accelerator and (F) an inorganic filler. A semiconductor device using the liquid resin composition described above. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101269800-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03085024-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7067605-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007197510-A |
| priorityDate |
2000-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |