| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate |
2001-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e8332a2866ba8c1d6194f07c7a034d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_253b92d40d142a6aeca28ee739bf8f18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_584631f8578abd8a289d619a446cabe2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a8001064810edf2b560b4b231dd6839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_917902633d77c4f247bdff085add7ebc |
| publicationDate |
2001-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001276996-A |
| titleOfInvention |
Solder alloy, solder powder, solder paste, printed wiring board, electronic component, soldering method and soldering apparatus |
| abstract |
(57) Abstract: The present invention relates to a lead (Pb) -free solder alloy, a solder powder and a solder paste, and a printed wiring board and an electronic component. It is intended to reduce SOLUTION: The composition of a solder alloy has a content of bismuth (Bi) having a value exceeding 0.5% by weight and not exceeding 60% by weight, and a composition having a content of not less than 0.5% by weight and not exceeding 50% by weight. It consists of indium (In) and silver (Ag) having a content of 1% by weight or more and less than 5% by weight, and the remaining amount is tin (S). n). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014018803-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7984841-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4746985-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1429359-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1429359-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112658526-A |
| priorityDate |
1994-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |