| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-10 |
| filingDate |
2000-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dffb7d4469bfb600a92f21a756e66df4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02e70996a75ee5c7ac64e03c18820582 |
| publicationDate |
2001-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001274271-A |
| titleOfInvention |
Manufacturing method of electronic component device |
| abstract |
(57) [Problem] To provide a method of manufacturing an electronic component device capable of completely hermetically sealing without affecting an electronic component B inserted into a housing 6. A sealing material is applied to a surface of a metal lid body on a case side in advance, and a sealing material accumulating portion (fillet portion) that comes into contact with an inner wall surface of a side wall on the housing side is formed in advance. An electronic component manufacturing method characterized by being formed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003258566-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006237909-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10554192-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104702233-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10507514-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104702233-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10532434-B2 |
| priorityDate |
2000-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |