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filingDate 2000-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001271058-A
titleOfInvention Manufacturing method of polishing slurry
abstract (57) [PROBLEMS] To provide a polishing slurry capable of reducing scratches on a wafer surface after CMP polishing and a method for producing the polishing slurry. SOLUTION: A step of dispersing an aqueous dispersion of abrasive grains in which abrasive grains such as silica particles are dispersed in an aqueous medium with a high-pressure homogenizer, and adding a thickener to the obtained aqueous dispersion of abrasive grains. And a mixing step.
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