http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001267337-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P80-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate | 2000-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2aacfdad8320b133008c07a926ac9002 |
| publicationDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001267337-A |
| titleOfInvention | Tablets for resin-encapsulated semiconductor devices |
| abstract | (57) [Summary] [PROBLEMS] To seal a large chip into a small and thin package, which is excellent in workability and moldability, has low thermal stress inside the package, and has the effect of removing the package due to heating during mounting. A tablet for a resin-encapsulated semiconductor device that is free from cracks, has excellent resistance to soldering stress, and has high package reliability is provided with improved raw material loss and economical efficiency. A tablet for a resin-encapsulated semiconductor device is provided. Resin composition (A) having a flexural modulus of 980 N / mm 2 or less And a resin composition (B) having a flexural modulus of 9800 N / mm 2 or more, and the resin composition (B) was formed so as to surround the resin composition (A). It has a layer structure. Further, the resin composition (A) is a composite resin composition containing, as essential components, a resin having a physical cross-linking portion composed of an ionic bond or a low-stress resin composed of a thermoplastic elastomer and a thermosetting resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5157911-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008053694-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012254925-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8066810-B2 |
| priorityDate | 2000-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.