http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001262329-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9003d717bb40121f7d68127c582a63d5 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 |
| filingDate | 2000-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d0a9852d192737f98d8662b627faf44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_080099a24062b2fa427cbb18b6763d51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc2ba0bb3c1874b98ab8260177e07fcb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfbf79bc95e2ec75500b4b8786ef3b50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6548ec3a502fe7e55524200de79b7e4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117b481d3231906912cb36e5595bac56 |
| publicationDate | 2001-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001262329-A |
| titleOfInvention | Solid state diffusion bonding sputtering target assembly and method of manufacturing the same |
| abstract | (57) [Problem] Even after diffusion bonding, the crystal structure and crystal orientation of the target material are maintained, the strength of the backing plate material is secured, and the target material and the backing plate material are deformed. And a method of manufacturing the same. SOLUTION: A target material of Ti, Ta or Nb and A l or its alloy backing plate, A physical vapor deposition coating film of i, Ta, Nb or an alloy thereof is provided, and the target material and the backing plate material are diffusion-bonded. A physical vapor-deposited coating film is formed on the bonding side surface of the target material, and the surface provided with the coating film on the target material is used as a bonding surface in a vacuum atmosphere of 0.1 Pa or less, 40 Solid phase diffusion bonding is performed at a bonding temperature of 0 ° C. to 500 ° C., a bonding load pressure of 50 MPa or less, and a bonding time of 2 hours or less to obtain a target assembly. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111681782-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009197332-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014051693-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111681782-A |
| priorityDate | 2000-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.