abstract |
(57) [Problem] To provide a method for mounting a fine chip such as a semiconductor chip which can efficiently mount a fine semiconductor chip or the like at a desired position on a substrate with a high yield. SOLUTION: A mounting substrate 6 is immersed in a solvent 2 in which fine chips (LED chips 3) are dispersed, and an electric field gradient is formed corresponding to a position to be mounted on the mounting substrate, thereby mounting the fine chips. It is assembled on the substrate 6. |