abstract |
(57) [Problem] To provide a liquid sealing resin composition having higher reliability in a liquid sealing resin composition for sealing a semiconductor element or the like. SOLUTION: (A) Epoxy resin A represented by the formula (1), (B) Epoxy resin B represented by the formula (2), (C) It is a liquid sealing resin composition comprising a curing agent and (D) silica. Further, the present invention is a semiconductor device manufactured by sealing a semiconductor element using the above liquid sealing resin composition. Embedded image |