http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001240668-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-44 |
| filingDate | 2000-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25939ebc71d1dea565f3a31e8542ce6f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82fa443328e72b57236f5bb985efa2f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_556b020014493f2742249b946ab81bfb |
| publicationDate | 2001-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001240668-A |
| titleOfInvention | Polyimide resin composition for electrodeposition, method for producing the same, electrodeposited molded article, and method for producing the same |
| abstract | (57) [Problem] To provide an electrodeposition polyimide resin composition containing a heat-resistant polyimide resin having a solvent solubility and a low coefficient of thermal expansion, and a method for producing a molded article using the resin composition. Provided is a heat-resistant polyimide resin molded product having low coefficient of thermal expansion obtained by the production method, preferably a solvent-insoluble molded product. SOLUTION: The following general formula (1): (X is a tetravalent organic group, R 1 is a divalent, trivalent or tetravalent diamine, and preferably, the trivalent or tetravalent diamine or triamine of R 1 is the total mole of diamine or triamine. 3 to 100% of the numbers contain a sulfonic acid group and / or a sulfinic acid group in the skeleton, and n represents an integer of 3 to 800.) It is a polyimide resin composition for electrodeposition characterized by containing a solvent-soluble polyimide having the following formula, water and a basic compound. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109134860-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008280541-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109134272-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109251314-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109251315-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108976420-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110093177-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007138142-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101660315-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011132526-A |
| priorityDate | 2000-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.