http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001237548-A

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filingDate 2000-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4b6274e6ff3ff57e7ccea4cf6e24d7e
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publicationDate 2001-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001237548-A
titleOfInvention Method of forming via hole in metal-clad laminate
abstract (57) Abstract: A method for forming a via hole in a metal-clad laminate in a short time and in a smooth shape is provided. By using a thermoplastic liquid crystal polymer film as an electrically insulating polymer of a metal-clad laminate, a time for forming a via hole in the thermoplastic liquid crystal polymer film by irradiation with a laser can be shortened. , Residual beard in the via hole 3 (smear) Therefore, via holes 3 having a smooth shape can be formed in a short time after the smear removal treatment (desmear treatment) by the chemical.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008004307-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008129664-A1
priorityDate 2000-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 24.