http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001234368-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-30
filingDate 2000-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f2a7d27a6474af90d156351fadfd473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18ce4d675b325f4c2ec709efb59a785b
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publicationDate 2001-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001234368-A
titleOfInvention Circuit board manufacturing method, etching method and etching apparatus
abstract (57) Abstract: An object of the present invention is to improve the accuracy of a pattern formed on a circuit board by suppressing a decrease in an etching rate, thereby suppressing a failure due to an unetched residue. It is to provide a manufacturing method of. Another object of the present invention is to provide an etching method and an etching apparatus used for the method. Here, the circuit substrate includes a display substrate such as a plasma display panel or a liquid crystal display device, or a wiring substrate. In order to achieve the above object, the present invention provides a method for manufacturing a circuit board, comprising: a step of forming at least a Cr film on a substrate; and a step of forming a conductor pattern by etching the Cr film. The Cr film is etched using an electrolytically oxidized etchant.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015042404-A
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priorityDate 2000-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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