http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001233942-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
filingDate | 2000-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
publicationDate | 2001-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2001233942-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | (57) [Problem] To provide an epoxy resin composition excellent in moldability, flame retardancy, high-temperature storage characteristics, and solder crack resistance. SOLUTION: (A) a polyfunctional phenol resin (a); Phenols (b) which are precursors of crystalline epoxy resins And glycidyl etherified epoxy resin, (B) a modified phenolic resin obtained by polycondensing a petroleum heavy oil or pitches, a formaldehyde polymer and a phenol in the presence of an acid catalyst, (C) an inorganic filler, and (D) curing acceleration An epoxy resin (A) having a weight ratio (a / b) of 1 to 19 and a softening point of the epoxy resin (A) of 60 to 120C. An epoxy resin composition for stopping. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059838-A |
priorityDate | 2000-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 108.