Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
2000-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bf27b15f969ca035ab9b706a455dbe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a539ff0345f04c12ed9ccd4975f294f8 |
publicationDate |
2001-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2001233939-A |
titleOfInvention |
Liquid sealing resin composition and semiconductor device using the same |
abstract |
(57) [Problem] To provide a liquid sealing resin composition having higher reliability in a liquid sealing resin composition for sealing a semiconductor element or the like. A liquid sealing resin composition comprising (A) an epoxy resin represented by the formula (1), (B) a curing agent, and (C) silica. Further, the present invention is a semiconductor device manufactured by sealing a semiconductor element using the above liquid sealing resin composition. Embedded image |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005322831-A |
priorityDate |
2000-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |