http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001226564-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2000-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2734ad61dedaae0120a04c766000f23 |
| publicationDate | 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001226564-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability, flame retardancy, high-temperature storage characteristics, humidity resistance and solder crack resistance. Providing a composition. SOLUTION: (A) epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, (E) metal hydroxide solid solution Mg 1-x M 2+ x (OH) 2 (Where M 2+ represents at least one divalent metal ion selected from the group consisting of Mn 2+ , Fe 2+ , Co 2+ , Zn 2+ , Cu 2+ and Ni 2+ , and x represents 0.01 ≦ x ≦ 0.5), and (F) the surface of red phosphorus is coated with aluminum hydroxide and then the surface is further coated with a phenol resin, and the average particle size is 0.1 to 70 μm. , Maximum particle size is 200 An epoxy resin composition for semiconductor encapsulation, comprising a red phosphorus-based flame retardant having a size of not more than μm as an essential component. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102030968-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003082197-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006008769-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003089745-A |
| priorityDate | 1999-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.