http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001226561-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate | 1999-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc14c36b3fd0db618ccaae0aabd697e0 |
| publicationDate | 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001226561-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability, flame retardancy, high-temperature storage characteristics, humidity resistance and solder crack resistance. Providing a composition. SOLUTION: An essential component is (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a metal hydroxide solid solution represented by the general formula (1). (E) The epoxy resin composition for semiconductor encapsulation, wherein the specific surface area of the metal hydroxide solid solution represented by the general formula (1) is 1.5 to 4.5 m 2 / g. Mg 1-x M 2+ x (OH) 2 (1) (where M 2+ is Mn 2+ , Fe 2+ , Co 2+ , Ni 2+ , Cu Represents at least one type of divalent metal ion selected from the group consisting of 2+ and Zn 2+ , and x represents a number satisfying 0.01 ≦ x ≦ 0.5) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006008769-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005281597-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003082197-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003268079-A |
| priorityDate | 1999-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.