http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001226462-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2000-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20c3fe8ff8452663ba93cb7850efa24 |
| publicationDate | 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001226462-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition excellent in moldability, flame retardancy, high-temperature storage characteristics, and solder crack resistance. (A) an epoxy resin, (B) a phenol resin obtained by polycondensing a petroleum heavy oil or pitches, a formaldehyde polycondensate and a phenol in the presence of an acid catalyst, and (C) an inorganic filler. And (D) a curing accelerator as an essential component, (C) 70 to 85% by weight of the inorganic filler in the total epoxy resin composition, and 0 or less of bromine atom and antimony atom in the entire epoxy resin composition. An epoxy resin composition for semiconductor encapsulation, which is less than 1% by weight. |
| priorityDate | 2000-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.