http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001226452-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2000-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20c3fe8ff8452663ba93cb7850efa24 |
| publicationDate | 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001226452-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [abstract] (with correction) [PROBLEMS] By using an ultra-low melt viscosity epoxy resin, a filler is highly filled to realize low moisture absorption, excellent in solder crack resistance, storage stability at room temperature, and quick curing. Provided is an epoxy resin composition for semiconductor encapsulation having excellent properties. SOLUTION: An epoxy resin mixed with bisphenol F and a phenol which is a precursor of a crystalline epoxy resin and glycidyl etherified, a phenol resin curing agent, An inorganic filler, a conjugate base of a tetra-substituted phosphonium (X) and a compound (Y) having two or more phenolic hydroxyl groups in one molecule and a compound (Y) having two or more phenolic hydroxyl groups in one molecule A molecular aggregate, The conjugate base comprises, as an essential component, a curing accelerator composed of a phenoxide-type compound obtained by removing one hydrogen from the compound (Y) having two or more phenolic hydroxyl groups in one molecule, and the content of the inorganic filler is all It is 900 to 2400 parts by weight per 100 parts by weight of the total amount of the epoxy resin and all phenolic resin curing agents. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007178937-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008001748-A |
| priorityDate | 2000-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.