| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 |
| filingDate |
2000-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05f9f0928141c805074ac7bf77777d11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_813ca1ae71389d97f1693e3d8351d8eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb1a3f9addfbfe00e001efb66b0aa3da |
| publicationDate |
2001-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001223472-A |
| titleOfInvention |
Insulation material for multilayer board with good adhesion to copper circuit |
| abstract |
PROBLEM TO BE SOLVED: To provide an insulating material for a multilayer substrate having excellent adhesiveness to a copper circuit and excellent dielectric properties. SOLUTION: A thermosetting resin (A) layer and a thermoplastic resin (B) layer are alternately laminated in two to five layers, at least one surface of an outer surface layer is a (B) layer, and the (A) layer An insulating material for a multilayer substrate is used, which has a dielectric constant of 1.5 to 3.5 after curing. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014113705-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007115722-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011159725-A |
| priorityDate |
1999-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |