http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001223467-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2000-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eb574d486d7f7130916e24fada882a3 |
| publicationDate | 2001-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001223467-A |
| titleOfInvention | Printed wiring board and method for manufacturing printed wiring board |
| abstract | (57) Abstract: Provided is a printed wiring board and a method for manufacturing the printed wiring board, in which a through hole can be appropriately formed by laser. A core material 30 in which a core material is impregnated with resin. A through hole 32 is formed by laser in a core substrate 30 composed of a and a resin insulating layer 30b formed on both surfaces of the core material 30a and having a roughened surface. Since the through-hole is formed in a state where the metal layer is not formed, the through-hole can be appropriately formed, and the connection reliability of the printed wiring board can be improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006351770-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112770497-A |
| priorityDate | 2000-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.