| abstract |
(57) Abstract: A wafer having improved reliability of electrical connection between an external terminal and a through hole provided between an electrode or other conductor formed on the surface or inside of an inspection stage. Providing a prober. A chuck top conductor layer (36) is formed on the surface of a ceramic stage (12) on which a semiconductor wafer is mounted, and electrodes (14, 16) are formed inside the ceramic stage (12). , 26 and through holes 20, 22 for electrically connecting external terminals 24, 26. 28 and 30 are formed. Then, a part of the blind holes 28 and 30 is made conductive. |