patent/JP-2001223243-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001223243-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1411 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81194 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2000-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_053c98eab77f5f02d33d3fb12ebd2291
publicationDate	2001-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-2001223243-A
titleOfInvention	Semiconductor device and its manufacturing method, circuit board, and electronic equipment
abstract	An object of the present invention is to provide a semiconductor device and a method of manufacturing the same, a circuit board, and an electronic device that can secure electrical connection reliability. SOLUTION: The semiconductor device has a plurality of electrodes 12, A semiconductor chip 10 having a bump 16 formed on each electrode 12, a substrate 20 on which the semiconductor chip 10 is mounted and a wiring 22 having a joint 24 with the bump 16 is formed; The bonding portion 24 of the wiring 22 enters the bump 16 and is bonded, and the conductive particles 27 are interposed between the bonding portion 24 and the bump 16.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009212203-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7054025-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1391922-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1391922-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003107086-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7304394-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005004050-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110066365-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009246337-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7180196-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008027933-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232640-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101673593-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100523495-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6897552-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002170838-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100727506-B1
priorityDate	2000-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935

Total number of triples: 47.