| abstract |
[PROBLEMS] To establish a technique for directly evaluating the surface state of a polishing pad, enable high-precision CMP processing management, and improve processing throughput. The surface of a pad is irradiated with light, and the surface of the pad is directly evaluated based on the intensity of reflected light or fluorescence from the light irradiation area or an intensity distribution image. The dressing conditions of the dresser 4 are optimized based on the evaluation result, and a high-precision CMP process is performed while maintaining a good pad surface state. |