Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
filingDate |
2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1a337cccc759a68686eec78693e2882 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd4f189cfac304c3273283d0a8ba8c14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_002f3e06d2ac22a65d6c1bd0c0b0b986 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88db1e59128eb984cf0adcbde537280c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04cdfadce387fe899c29d33e742049d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6413736be9c034f094e97e98af16f8ca |
publicationDate |
2001-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2001220566-A |
titleOfInvention |
Method for producing adhesive composition, adhesive composition, adhesive film, wiring board for mounting semiconductor, and semiconductor device |
abstract |
(57) [Problem] It is an object of the present invention to provide an adhesive composition having excellent heat resistance after absorbing moisture. An adhesive composition produced by mixing an epoxy resin, a curing agent and a filler, and then mixing the mixture with a high molecular weight component that is incompatible with the epoxy resin is used. . |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111670231-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007284670-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004123796-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111670231-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004043760-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006183020-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8017444-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019182001-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012052126-A |
priorityDate |
1999-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |