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filingDate 2000-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1a337cccc759a68686eec78693e2882
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publicationDate 2001-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001220566-A
titleOfInvention Method for producing adhesive composition, adhesive composition, adhesive film, wiring board for mounting semiconductor, and semiconductor device
abstract (57) [Problem] It is an object of the present invention to provide an adhesive composition having excellent heat resistance after absorbing moisture. An adhesive composition produced by mixing an epoxy resin, a curing agent and a filler, and then mixing the mixture with a high molecular weight component that is incompatible with the epoxy resin is used. .
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111670231-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007284670-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004123796-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004043760-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006183020-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8017444-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019182001-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012052126-A
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