| abstract |
(57) Abstract: An imide-based photosensitive resin composition, an insulating film, which can be post-baked at a relatively low temperature and has an insulating film having heat resistance, acid resistance, alkali resistance, and heat resistance. It is to provide a method of forming the same. SOLUTION: (1) An imidosiloxane oligomer which is half-esterified at least after prebaking, (2) Photosensitive monomer, (3) photopolymerization initiator, (4) crosslinking aid, (5) It consists of a fine inorganic filler and (6) a solvent, and the proportion of each component is (2) photosensitive monomer-0.1 to 100 parts by weight of (1) half-esterified imide siloxane oligomer. 100 parts by weight, (3) 0.01 to 30 parts by weight of a photopolymerization initiator, (4) 1 to 75 parts by weight of a crosslinking aid, and (5) 1 to 50 parts by weight of a fine inorganic filler. Composition, An insulating film using the same and a method for forming the same. |