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filingDate 2000-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001214297-A
titleOfInvention Surface-treated copper foil, method for producing the surface-treated copper foil, and copper-clad laminate using the surface-treated copper foil
abstract (57) [Summary] [Problem] To maximize the effect of a silane coupling agent used for a copper foil having a brass rust-proof layer, to achieve a maximum thickness of 0.2 mm The hydrochloric acid resistance deterioration rate of 10% or less can be secured with the wide copper foil circuit. Moreover, it aims at supplying a surface-treated copper foil having excellent moisture resistance. The surface-treated copper foil is obtained by subjecting a surface of the copper foil to a roughening treatment and a rust prevention treatment. The rust prevention treatment comprises forming a zinc-copper brass plating layer on the copper foil surface. Forming an electrolytic chromate layer on the surface of the brass plating layer, forming a silane coupling agent adsorption layer on the electrolytic chromate layer, The temperature of the electrolytic copper foil itself is in the range of 105 ° C to 200 ° C, and 2 Depends on the surface-treated copper foil for a printed wiring board obtained by drying for up to 6 seconds.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014098174-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8147631-B2
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