abstract |
(57) Abstract: (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) an average particle size of 0.1 to An epoxy resin composition for semiconductor encapsulation, comprising a mixture of 10 μm dicyandiamide and a phenol resin melt-mixed at a weight ratio of 1: 1 to 1:10. The epoxy resin composition for semiconductor encapsulation of the present invention can reduce the warpage of a package and has good curability. |