http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001214036-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 |
| filingDate | 2000-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc9a57f71cc7d7eb772f50137d55fbde |
| publicationDate | 2001-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001214036-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which has less mold dirt, can be highly filled with an inorganic filler, and is excellent in mold releasability, moisture resistance and solder crack resistance. . SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a saturated fatty acid anhydride having 24 to 48 carbon atoms, and (F) a 12 carbon atoms. ~ A fatty acid amide of 40 and (G) a saturated fatty acid having 12 to 24 carbon atoms are essential components, and a weight ratio (E / F) of the component (E) to the component (F) is 10/90 to 90/10. An epoxy resin composition for encapsulating a semiconductor, comprising: |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009513759-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017130006-A1 |
| priorityDate | 2000-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.