| abstract |
(57) [Problem] To provide an epoxy resin composition having excellent heat resistance and insulating properties as a binder resin and further improving the electric and magnetic properties of a metal molded part. An epoxy resin having an epoxy equivalent of 500 g / eq or less (a), an epoxy resin having an epoxy equivalent of 800 g / eq or more and / or a phenol resin having a hydroxyl equivalent of 500 g / eq or more, a curing agent (c), and a curing accelerator. An epoxy resin composition containing an agent (d), a powder of a metal or a metal compound (e), and a silane coupling agent (f). |