| abstract |
PROBLEM TO BE SOLVED: To provide a resist pattern having excellent heat resistance and cross-sectional shape which can be suitably used as a thick film mask when performing ion implantation or plating on a substrate, in a short time. Provided is a negative resist substrate which can be formed well. SOLUTION: (A) m-cresol novolak resin, Alternatively, an alkali-soluble resin comprising a mixture of m-cresol novolak resin and poly- (hydroxystyrene), (B) an acid generator and (C) a crosslinking agent having a crosslinking forming group comprising a hydroxyalkyl group or a lower alkoxyalkyl group. Using a chemically amplified negative resist composition containing A negative resist layer having a thickness of 4.0 to 10.0 μm is formed on a substrate to form a negative resist base material. |