http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001205480-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2000-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_450ca765cc19807d1b9b818f2f4fdf85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20c881d520099a0aaf5b7f14a23b72b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329ed8caaa603682286660a4f4c44a83 |
| publicationDate | 2001-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001205480-A |
| titleOfInvention | Soldering flux |
| abstract | (57) [Summary] [PROBLEMS] To provide a highly stable soldering flux and solder paste, and a highly reliable soldering method and a joined article corresponding to fine pitch and diversification of parts. A flux-containing glycoside having a phenolic hydroxyl group is added as a reducing agent. 2 in solder powder The particles having a particle size of 0 μm or less are 30% or less in number distribution, the oxygen content is 500 ppm or less, and the water content in the solder paste is 0.5 wt% or less. |
| priorityDate | 2000-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 83.