http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001203371-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0fb905106eeabff9660bc073fb748ac5
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-0828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S73-01
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P1-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-5755
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0048
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
filingDate 2000-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0d30c355b8e5ef28b022c9723776983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee2002746e63dcb2b83db46b1c0353bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e39abf56bf998cce50b1ad0c3daab05
publicationDate 2001-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001203371-A
titleOfInvention Micro mechanical device
abstract (57) [Summary] (with correction) [PROBLEMS] To prevent internal stress from being generated during the manufacturing process of a sensor. A method of manufacturing a stress relief assembly of a cradle structure and, in particular, an acceleration sensor, an angular velocity sensor, and a micromechanical sensor such as an inclination sensor or an angular acceleration. At least one silicon seismic mass is used as a sensing element. The silicon seismic mass is bonded to a silicon frame via an assembly cradle, and the surface adheres to a coated wafer of glass or silicon.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6020590-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5971349-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014077298-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014077299-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008544243-A
priorityDate 1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18618944
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559585
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452580220
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5462311

Total number of triples: 42.