| abstract |
(57) [Solution] After treating a powder with a silicon-based polymer compound having a reducing property to form a silicon-based polymer compound layer on the surface of the powder, the powder is treated in a state without aggregation. The powder is dispersed in water, and then the powder is treated with a metal salt composed of a metal having a standard oxidation-reduction potential of 0.54 V or more to deposit a colloid of the metal on the silicon-based polymer compound layer, and then electrolessly plated. A method for producing a metal-coated conductive powder, comprising treating the powder with a liquid to deposit a metal film on the outermost surface of the powder. According to the present invention, a metal-coated powder having a uniform plating layer on the entire surface can be obtained efficiently and efficiently, and the obtained metal-coated powder has high conductivity. |