| abstract |
PROBLEM TO BE SOLVED: To be used for manufacturing a multilayer wiring board having a precise and high-density circuit, high heat resistance, high water resistance, and long-term stability under a high temperature storage test at 130 ° C or higher. A curable sheet is provided. SOLUTION: (A) A reaction product of a polyphenylene ether resin and an unsaturated carboxylic acid or an acid anhydride, (B) Triallyl isocyanurate and / or triallyl cyanurate, (C) a polymer block mainly composed of at least one vinyl aromatic compound and at least one Hydrogenated block copolymer obtained by hydrogenating a block copolymer consisting of a polymer block B mainly composed of two conjugated diene compounds, (D) an inorganic filler and (E) a brominated flame retardant. A thermosetting polyphenylene ether resin composition containing a specific proportion of sodium bromide (NaBr) and bromine (Br 2 ) contained as impurities in the above-mentioned component (E); curable sheet aBr is 50ppm or less, Br 2 is characterized by comprising a thermosetting polyphenylene ether resin composition is 100ppm or less. |